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HSS25-B20-P51
- Mfr.Part #
- HSS25-B20-P51
- Manufacturer
- CUI Devices
- Package/Case
- -
- Datasheet
- Download
- Description
- HEAT SINK, STAMPING, TO-218/TO-2
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- Manufacturer :
- CUI Devices
- Product Category :
- Thermal - Heat Sinks
- Attachment Method :
- PC Pin
- Diameter :
- -
- Material :
- Aluminum Alloy
- Material Finish :
- Black Anodized
- Package Cooled :
- TO-218, TO-220
- Power Dissipation @ Temperature Rise :
- 5.88W @ 75°C
- Product Status :
- Active
- Shape :
- Square, Fins
- Thermal Resistance @ Forced Air Flow :
- 6.30°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 12.75°C/W
- Type :
- Board Level
- Datasheets
- HSS25-B20-P51
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| HSS28-B20-P39 | CUI Devices | 6,500 | HEAT SINK, STAMPING, TO-218/TO-2 |
