IW-HSKALU-CLASLR-CU03

Mfr.Part #
IW-HSKALU-CLASLR-CU03
Manufacturer
iWave Systems
Package/Case
-
Datasheet
Download
Description
ZU+ MPSOC SOM MODULE HEATSINK

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Manufacturer :
iWave Systems
Product Category :
Thermal - Heat Sinks
Attachment Method :
Bolt On
Diameter :
-
Material :
Aluminum
Material Finish :
-
Package Cooled :
FPGA
Power Dissipation @ Temperature Rise :
-
Product Status :
Active
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
-
Thermal Resistance @ Natural :
-
Type :
Top Mount

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