272-6325-9UA-1902

Mfr.Part #
272-6325-9UA-1902
Manufacturer
3M
Package/Case
-
Datasheet
Download
Description
TEST BURN-IN PGA

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Manufacturer :
3M
Product Category :
IC Sockets
Contact Finish - Mating :
Gold
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
30.0µin (0.76µm)
Contact Finish Thickness - Post :
30.0µin (0.76µm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Beryllium Copper
Features :
Closed Frame
Housing Material :
Polyethersulfone (PES)
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
72 (25 x 25)
Operating Temperature :
-55°C ~ 150°C
Product Status :
Obsolete
Termination :
Solder
Type :
PGA, ZIF (ZIP)
Datasheets
272-6325-9UA-1902

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